This air cooler header box goes through a thermal cycle multiple times a day. Thermal stresses during a cycle exceed the stresses in steady state. Here using Ansys Workbench a transient thermal analysis was performed. This transient thermal profile is used to determine the thermal expansion and thereby the stresses in this nozzle and headerbox intersection. This showed that the thermal changes were not quick enough to generate the large thermal gradients that lead to excessive stresses.
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